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Supply and Installation of Die Bonder Assembly Equipment with Documentation and Training

Przedmiotem zamówienia jest dostawa, instalacja, uruchomienie i testowanie urządzenia do montażu Die bonder wraz z dokumentacją i szkoleniem.

Source ID: TED-88a1b017-3109-413a-89e4-6135ecd6db34

Scope overview

Przedmiotem zamówienia jest dostawa, instalacja, uruchomienie i testowanie urządzenia do montażu Die bonder wraz z dokumentacją i szkoleniem.

Statusopen
CategoryOther
CountryPoland
Publish dateJan 14, 2026
Submission deadlineJan 20, 2026
Estimated value
Notice typetender_notice
Sourceeu-ted-search
BuyerSieć Badawcza Łukasiewicz - Instytut Mikroelektroniki i Fotoniki
Buyer websitehttps://ted.europa.eu/
City

Buyer & contacts

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Emailagata.zygler@imif.lukasiewicz.gov.pl
Phone+48 225487828
OrganizationSieć Badawcza Łukasiewicz - Instytut Mikroelektroniki i Fotoniki

Tags & Signals

die bonderassembly equipmentsemiconductor manufacturingequipment installationtechnical documentationoperator trainingcommissioningmicroelectronics
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