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Fraunhofer Microelectronics Alliance Hosts Semiconductor Innovation Conference in Berlin

Der Fraunhofer-Verbund Mikroelektronik hat sich als Schlüsselakteur für angewandte Mikroelektronik-Forschung in Deutschland etabliert. Um zu zeigen, dass der Fraunhofer-Verbund Mikroelektronik für Systemintegration auf höchstem Niveau, für verbindliche Angebote an die Industrie und für eine zukunftsfähige Mikroelektron…

Source ID: TED-b289a2c9-5d60-421e-905b-9e56e0a36650

Scope overview

Der Fraunhofer-Verbund Mikroelektronik hat sich als Schlüsselakteur für angewandte Mikroelektronik-Forschung in Deutschland etabliert.

Um zu zeigen, dass der Fraunhofer-Verbund Mikroelektronik für Systemintegration auf höchstem Niveau, für verbindliche Angebote an die Industrie und für eine zukunftsfähige Mikroelektronikstrategie „made in Germany“ steht, veranstaltet der Fraunhofer-Verbund Mikroelektronik im Jahr 2026 die zweitägige Konferenz »FIRST by FMD – the conference for fast Innovation through Research in Semiconductor Technology« in Berlin, die sich an die Leitungsebene von Forschung, Industrie, Verbänden und Politik richtet und im Rahmen des Projekts »APECS« ausgerichtet wird.

Als Teil des EU-Chips-Acts stellt die APECS-Pilotlinie einen bedeutenden Fortschritt bei der Stärkung der Halbleiterfertigungskapazitäten und der Chiplet-Innovation in Europa dar. Alle Vorhaben im Rahmen der Pilotlinie zahlen auf den European Green Deal ein. Genauere Informationen entnehmen Sie bitte der Leistungsbeschreibung sowie den Vergabeunterlagen.

Statusopen
CategoryOther
CountryGermany
Publish dateJan 16, 2026
Submission deadline
Estimated value
Notice typetender_notice
Sourceeu-ted-search
BuyerFraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V.
Buyer websitehttps://ted.europa.eu/
City

Buyer & contacts

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Emaileinkauf@iis.fraunhofer.de
Phone+49 91317762230
OrganizationFraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V.

Tags & Signals

semiconductor conferencemicroelectronics researchEU Chips ActAPECS projectinnovation technologyFraunhofer Alliancechiplet innovationsemiconductor manufacturing

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